The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Nov. 08, 2019
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Hideki Furusawa, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B22F 1/145 (2022.01); H01B 1/02 (2006.01); H01B 5/14 (2006.01); B22F 1/103 (2022.01);
U.S. Cl.
CPC ...
B22F 1/145 (2022.01); H01B 1/026 (2013.01); H01B 1/22 (2013.01); H01B 5/14 (2013.01); B22F 1/103 (2022.01); B22F 1/147 (2022.01); B22F 2301/10 (2013.01);
Abstract
There is provided a more versatile technique that is useful for enhancing the sintering delay property of a metal powder. A metal powder surface-treated with at least one coupling agent comprising Si, Ti, Al or Zr, wherein a total adhesion amount of Si, Ti, Al and Zr is 200 to 10,000 μg with respect to 1 g of the surface-treated metal powder, wherein a 1% by mass aqueous solution of the coupling agent indicates a pH of 7 or less, and wherein a sintering starting temperature is 500° C. or higher.