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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11565026 B1

PDFFull Text
Date of Patent:
Jan. 31, 2023

Filed:

May. 05, 2021

3d printing of biomedical implants

Applicant:

Northwestern University, Evanston, IL (US);

Inventors:

Jian Yang, Evanston, IL (US);

Evan C. Baker, Chicago, IL (US);

Henry O. T. Ware, Shawnee, OK (US);

Fan Zhou, Torrance, CA (US);

Cheng Sun, Willmette, IL (US);

Guillermo A. Ameer, Chicago, IL (US);

Robert Van Lith, Evanston, IL (US);

Assignee:

Northwestern University, Evanston, IL (US);

Attorneys:

Casimir Jones SC

David W. Staple

Primary Examiner:

Nahida Sultana

Int. Cl.
CPC ...
A61L 31/06 (2006.01); C08J 3/24 (2006.01); B33Y 80/00 (2015.01); B29C 64/135 (2017.01); B29C 41/22 (2006.01); B29C 41/00 (2006.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B29C 64/20 (2017.01); A61L 31/16 (2006.01); A61L 31/18 (2006.01); C09D 167/06 (2006.01); B29L 31/00 (2006.01); B33Y 10/00 (2015.01); B29K 33/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
A61L 31/06 (2013.01); A61L 31/16 (2013.01); A61L 31/18 (2013.01); B29C 41/00 (2013.01); B29C 41/22 (2013.01); B29C 64/135 (2017.08); B29C 64/20 (2017.08); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C08J 3/24 (2013.01); C09D 167/06 (2013.01); B29K 2033/00 (2013.01); B29K 2105/0005 (2013.01); B29K 2995/006 (2013.01); B29K 2995/0056 (2013.01); B29L 2031/7534 (2013.01); B33Y 10/00 (2014.12); C08J 2367/06 (2013.01);
Abstract

Provided herein are methods, compositions, devices, and systems for the 3D printing of biomedical implants. In particular, methods and systems are provided for 3D printing of biomedical devices (e.g., endovascular stents) using photo-curable biomaterial inks (e.g., or methacrylated poly(diol citrate)).

Find Patent Forward Citations

Yang, Jian. (2023). 3d printing of biomedical implants (U.S. Patent No. 11565026). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11565026

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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