The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

Nov. 18, 2020
Applicant:

Ford Global Technologies, Llc, Dearborn, MI (US);

Inventors:

Stuart Salter, White Lake, MI (US);

Paul Kenneth Dellock, Northville, MI (US);

Thomas Hermann, Troy, MI (US);

Tye Winkel, Canton, MI (US);

Assignee:

Ford Global Technologies, LLC, Dearborn, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H02G 3/08 (2006.01); B60R 16/02 (2006.01); H05K 7/20 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0045 (2013.01); B60R 16/02 (2013.01); H02G 3/088 (2013.01); H05K 5/0052 (2013.01); H05K 7/20854 (2013.01);
Abstract

Example embodiments described in this disclosure are generally directed to a plastic enclosure that provides EMI shielding and heat sinking to an electronic assembly. In one embodiment, the enclosure includes a housing portion formed of a base material that includes a polymer containing graphene nanostructures and carbon nanostructures. The graphene nanostructures provide a thermal conductivity characteristic to the base material. A set of standoff elements made of the base material is provided inside the housing for mounting the electronic assembly. Heat generated by the electronic assembly is conducted out of the enclosure by the standoff elements due to the graphene nanostructures. The carbon nanostructures provide an electrical conductivity characteristic to the base material. A lid formed of the base material may be attached to the housing portion. The carbon nanostructures in the housing portion and the lid provide EMI shielding to the electronic assembly inside the enclosure.


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