The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

May. 17, 2021
Applicant:

Nippon Mektron, Ltd., Tokyo, JP;

Inventor:

Fumihiko Matsuda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/116 (2013.01); H05K 3/02 (2013.01); H05K 3/4602 (2013.01); H05K 3/4673 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/061 (2013.01); H05K 2203/107 (2013.01);
Abstract

A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.


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