The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

Mar. 20, 2019
Applicant:

Rolls-royce Deutschland Ltd & CO KG, Blankenfelde-Mahlow, DE;

Inventors:

Rene Blank, Berlin, DE;

Martin Franke, Berlin, DE;

Peter Frühauf, Falkensee, DE;

Matthias Heimann, Potsdam, DE;

Nora Jeske, Berlin, DE;

Rüdiger Knofe, Teltow, DE;

Bernd Müller, Falkenberg, DE;

Stefan Nerreter, Heidesee, DE;

Jörg Strogies, Berlin, DE;

Klaus Wilke, Berlin, DE;

Ulrich Wittreich, Velten, DE;

Assignee:

Rolls-Royce Deutschland Ltd & Co KG, Blankenfelde-Mahlow, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G11B 33/08 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); G11B 33/08 (2013.01); H05K 3/4691 (2013.01); H05K 1/181 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/2045 (2013.01);
Abstract

The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (), characterized by at least one separating element () formed in the wiring carrier plate (), which separating element divides the wiring carrier plate () into sections separated by the separating element (), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks () arranged on the wiring carrier plate (), and power semiconductors ().


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