The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2023
Filed:
Jan. 22, 2019
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventor:
Kazuyuki Tomida, Kanagawa, JP;
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 21/8234 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1033 (2013.01); H01L 21/823412 (2013.01); H01L 29/04 (2013.01); H01L 29/0657 (2013.01); H01L 29/78 (2013.01);
Abstract
To further reduce contact resistance when a current or a voltage is taken out from a metal layer. A conductive structure including: an insulating layer; a metal layer provided on one surface of the insulating layer to protrude in a thickness direction of the insulating layer; and a two-dimensional material layer provided along outer shapes of the metal layer and the insulating layer from a side surface of the metal layer to the one surface of the insulating layer.