The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

Oct. 31, 2019
Applicant:

Milaebo Co., Ltd., Pyeongtaek-si, KR;

Inventors:

Che Hoo Cho, Seongnam-si, KR;

Yeon Ju Lee, Osan-si, KR;

Myung Pil Han, Yongin-si, KR;

Assignee:

MILAEBO CO., LTD., Pyeongtaek-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); B01D 8/00 (2006.01); B01D 53/00 (2006.01); H01L 23/427 (2006.01); C23C 16/44 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); F16T 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); B01D 8/00 (2013.01); B01D 53/002 (2013.01); B01D 53/005 (2013.01); C23C 16/4412 (2013.01); F16T 1/00 (2013.01); H01L 21/02 (2013.01); H01L 21/67103 (2013.01); H01L 21/67207 (2013.01); H01L 23/427 (2013.01); B01D 2258/0216 (2013.01);
Abstract

ABSTRACT An apparatus is for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing cooling channel on an inner wall thereof to cool exhaust gas which is temperature-controlled by a heater while being introduced through a gas inlet of an upper plate; an internal collecting tower including multiple vertical plates and multiple horizontal plates that are assembled, and condensing and collecting a by-product from the exhaust gas; a main cooling channel having a serpentine shape and cooling the exhaust gas uniformly by using coolant while passing through the internal collecting tower; and a multi-connection pipe sequentially supplying the coolant to the upper plate cooling channel, the housing cooling channel, and the main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe that are provided outside the housing.


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