The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

Aug. 13, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sooyong Lee, Yongin-si, KR;

Mincheol Kang, Hwaseong-si, KR;

Bongsoo Kang, Seoul, KR;

Jeeyong Lee, Anyang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 27/11556 (2017.01); G06N 3/08 (2006.01); G06N 3/04 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); G06N 3/0454 (2013.01); G06N 3/088 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes forming a lower mold having lower layers stacked on a substrate and lower channel structures passing therethrough; forming an upper mold including upper layers stacked on the lower mold and upper channel structures passing therethrough; removing the upper mold to expose an upper surface of the lower mold; separating an upper original image in which traces of the upper channel structures are displayed, and a lower original image in which the lower channel structures are displayed, from an original image capturing the upper surface of the lower mold; inputting the upper original image into a learned neural network to acquire an upper restored image in which cross sections of the upper channel structures are displayed; and comparing the upper restored image with the lower original image to verify an alignment state of the upper and lower molds.


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