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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11562911 B1

PDFFull Text
Date of Patent:
Jan. 24, 2023

Filed:

Jul. 23, 2020

Power semiconductor module and method of forming the same

Applicant:

Hitachi Energy Switzerland Ag, Baden, CH;

Inventors:

Daniele Torresin, Baden, CH;

Thomas Gradinger, Aarau Rohr, CH;

Juergen Schuderer, Zürich, CH;

Assignee:

Hitachi Energy Switzerland AG, Baden, CH;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Dale E Page

Assistant Examiner:

Abbigale A Boyle

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/473 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4882 (2013.01); H01L 23/10 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/473 (2013.01); Y10T 29/49144 (2015.01);
Abstract

One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.

Find Patent Forward Citations

Torresin, Daniele. (2023). Power semiconductor module and method of forming the same (U.S. Patent No. 11562911). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11562911

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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