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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11561468 B1

PDFFull Text
Date of Patent:
Jan. 24, 2023

Filed:

Jan. 30, 2020

Pattern forming method

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Tomohiro Saito, Utsunomiya, JP;

Toshiki Ito, Kawasaki, JP;

Tomonori Otani, Fukui, JP;

Assignee:

CANON KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Venable LLP

Primary Examiner:

Mathieu D Vargot

Int. Cl.
CPC ...
G03F 7/00 (2006.01); B29C 59/02 (2006.01); B29C 59/16 (2006.01); C08F 22/10 (2006.01); H05K 3/00 (2006.01); G02B 5/18 (2006.01); G02B 5/30 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 59/02 (2013.01); B29C 59/16 (2013.01); C08F 22/1006 (2020.02); H05K 3/0079 (2013.01); H05K 3/0082 (2013.01); G02B 5/1852 (2013.01); G02B 5/3025 (2013.01); G02B 2207/101 (2013.01);
Abstract

A pattern forming method comprises dispensing a curable composition onto an underlayer of a substrate; bringing the curable composition into contact with a mold; irradiating the curable composition with light to form a cured film; and separating the cured film from the mold. The proportion of the number of carbon atoms relative to the total number of atoms in the underlayer is 80% or more. The dispensing step comprises a first dispensing step of dispensing a curable composition (A1) substantially free of a fluorosurfactant onto the underlayer, and a second dispensing step of dripping a droplet of a curable composition (A2) having a fluorosurfactant concentration in components excluding a solvent of 1.1% by mass or less onto the curable composition (A1) discretely.

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