The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

Jul. 29, 2019
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Shengguang Ban, Beijing, CN;

Shuilang Dong, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/13357 (2006.01); H01L 33/60 (2010.01); G02F 1/1335 (2006.01); H01L 25/075 (2006.01); G09G 3/22 (2006.01); G09G 3/32 (2016.01);
U.S. Cl.
CPC ...
G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); G02F 1/133612 (2021.01); G09G 3/22 (2013.01); G09G 3/32 (2013.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01); G02F 2201/07 (2013.01); G02F 2201/50 (2013.01); G02F 2202/16 (2013.01); G09G 2300/0426 (2013.01); H05K 2201/10106 (2013.01);
Abstract

The present disclosure provides a binding backplane and a manufacturing method thereof, a backlight module and a display device. The binding backplane includes: a substrate; a first trace layer on the substrate; a planarizing layer on a side of the first trace layer away from the substrate; a second trace layer on the planarizing layer and including a connecting portion and a binding portion; a surface protective layer on the second trace layer away and exposing the binding portion; and a conductive reflection structure on a side of the surface protective layer close to the substrate, wherein the conductive reflection structure includes a grounding portion, a distance between a surface of the grounding portion away from the substrate and the substrate is not greater than a distance between a surface of the binding portion away from the substrate and the substrate.


Find Patent Forward Citations

Ban, Shengguang. (2023). Binding backplane and manufacturing method thereof, backlight module and display device (U.S. Patent No. 11561431). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11561431

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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