The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

Sep. 16, 2020
Applicant:

University of South Florida, Tampa, FL (US);

Inventors:

Venkat Rama Bhethanabotla, Tampa, FL (US);

Thomas M. Weller, Corvallis, OR (US);

Roger Brandon Tipton, Wesley Chapel, FL (US);

John Townsend Bentley, Tampa, FL (US);

Eduardo Antonio Rojas, Port Orange, FL (US);

Assignee:

University of South Florida, Tampa, FL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/122 (2006.01); B29D 11/00 (2006.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); G02B 6/12 (2006.01); G02B 6/13 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/1221 (2013.01); B29D 11/00663 (2013.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); G02B 6/12002 (2013.01); G02B 6/13 (2013.01); B29K 2101/12 (2013.01);
Abstract

A novel polymer optical waveguide and method of manufacturing is presented herein. A digitally manufactured process is described which utilizes a micro-dispensed UV optical adhesive as the contour guiding cladding, a fused deposition modeling technology for creating a core, and a subtractive laser process to finish the two ends of the optical interconnect. The optical waveguide can be printed directly on a circuit board in some embodiments. Alternatively, using a slightly modified process including a step to bond the optical fiber to the substrate, the optical interconnect can be manufactured on a flexible substrate.


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