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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11560913 B1

PDFFull Text
Date of Patent:
Jan. 24, 2023

Filed:

Jan. 16, 2019

Brazed joint and semiconductor processing chamber component having the same

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Govinda Raj, Santa Clara, CA (US);

Tom K. Cho, Los Altos, CA (US);

Hamid Mohiuddin, Campbell, CA (US);

Ian Widlow, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

Patterson + Sheridan, LLP

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 1/00 (2006.01); F16B 5/08 (2006.01); B23K 1/20 (2006.01); C04B 37/02 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
F16B 5/08 (2013.01); B23K 1/0016 (2013.01); B23K 1/206 (2013.01); C04B 37/023 (2013.01); C04B 37/026 (2013.01); B23K 2101/40 (2018.08); B23K 2103/172 (2018.08); B23K 2103/52 (2018.08); C04B 2235/5216 (2013.01); C04B 2235/5256 (2013.01); C04B 2237/122 (2013.01); C04B 2237/123 (2013.01); C04B 2237/124 (2013.01); C04B 2237/125 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/403 (2013.01); C04B 2237/405 (2013.01); C04B 2237/406 (2013.01); C04B 2237/52 (2013.01); C04B 2237/595 (2013.01); C04B 2237/72 (2013.01); C04B 2237/74 (2013.01); C04B 2237/76 (2013.01); C04B 2237/84 (2013.01);
Abstract

Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.

Find Patent Forward Citations

Quick Actions:

Raj, Govinda. (2023). Brazed joint and semiconductor processing chamber component having the same (U.S. Patent No. 11560913). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11560913

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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