The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

May. 23, 2018
Applicant:

Starfire Industries Llc, Champaign, IL (US);

Inventors:

Brian Edward Jurczyk, Champaign, IL (US);

Robert Andrew Stubbers, Savoy, IL (US);

Assignee:

STARFIRE INDUSTRIES LLC, Champaign, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/511 (2006.01); C23C 16/455 (2006.01); C23C 16/513 (2006.01); C23C 16/02 (2006.01); H01J 37/32 (2006.01); C23C 16/515 (2006.01); C23C 14/02 (2006.01); C23C 14/34 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 16/511 (2013.01); C23C 14/021 (2013.01); C23C 16/0227 (2013.01); C23C 16/4551 (2013.01); C23C 16/45576 (2013.01); C23C 16/45595 (2013.01); C23C 16/513 (2013.01); C23C 16/515 (2013.01); H01J 37/32192 (2013.01); H01J 37/32201 (2013.01); H01J 37/32247 (2013.01); H01J 37/32449 (2013.01); C23C 14/34 (2013.01); H01J 37/3444 (2013.01); H01J 37/3467 (2013.01); H01J 2237/332 (2013.01);
Abstract

A system and method are described for depositing a material onto a receiving surface, where the material is formed by use of a plasma to modify a source material in-transit to the receiving surface. The system comprises a microwave generator electronics stage. The system further includes a microwave applicator stage including a cavity resonator structure. The cavity resonator structure includes an outer conductor, an inner conductor, and a resonator cavity interposed between the outer conductor and the inner conductor. The system also includes a multi-component flow assembly including a laminar flow nozzle providing a shield gas, a zonal flow nozzle providing a functional process gas, and a source material flow nozzle configured to deliver the source material. The source material flow nozzle and zonal flow nozzle facilitate a reaction between the source material and the functional process gas within a plasma region.


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