The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

Jan. 31, 2019
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Eric Martin, Corvallis, OR (US);

Daryl E. Anderson, Corvallis, OR (US);

James R. Przybyla, Corvallis, OR (US);

Chien-Hua Chen, Corvallis, OR (US);

Diane R. Hammerstad, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04563 (2013.01); B41J 2/0458 (2013.01); B41J 2/04581 (2013.01); B41J 2/14016 (2013.01); B41J 2/1433 (2013.01); B41J 2/14201 (2013.01);
Abstract

One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.


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