The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Apr. 14, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jin Uk Lee, Suwon-si, KR;
Sangik Cho, Suwon-si, KR;
Eun Sun Kim, Suwon-si, KR;
Young Hun You, Suwon-si, KR;
Jong Eun Park, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/20 (2006.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H05K 1/09 (2013.01); H05K 3/205 (2013.01); H05K 3/184 (2013.01); H05K 3/244 (2013.01); H05K 2201/032 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/0379 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/099 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A printed circuit board includes an insulating layer, a circuit pattern embedded in the insulating layer and including a first metal layer, a second metal layer and a third metal layer disposed between the first metal layer and the second metal layer, and a connection conductor disposed on one surface of the insulating layer and connected to the circuit pattern, wherein the first metal layer is exposed through the one surface of the insulating layer.