The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Nov. 30, 2021
Applicant:

Bae Systems Controls Inc., Endicott, NY (US);

Inventors:

Nicholas A. Lemberg, Endwell, NY (US);

Robert J. Vovos, Vestal, NY (US);

Assignee:

BAE Systems Controls Inc., Endicott, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/687 (2006.01); H02M 1/088 (2006.01); H02M 7/5387 (2007.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H03K 17/12 (2006.01);
U.S. Cl.
CPC ...
H03K 17/6871 (2013.01); H02M 1/088 (2013.01); H02M 7/5387 (2013.01); H03K 17/122 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 2201/10166 (2013.01);
Abstract

An electronic power device including transistors formed on a circuit assembly formed of a plurality of layers. The layers include gate drive layers, gate return layers, and power layers. A gate drive circuit is formed on the circuit assembly, and is connected to the gate and source of each of the transistors through the gate drive layers and the gate return layers. A voltage supply connection is provided to each of the plurality of transistors interleaved through the power layers. The circuit assembly includes a multilayer circuit board and/or a multilayer ceramic substrate. The ceramic substrate includes the power layers and transistors. The gate drive and return layers and gate drive circuit may be formed within the ceramic substrate or the circuit board. The ceramic substrate may be located in a modular housing. The circuit board may be outside the modular housing or inside the modular housing.


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