The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Sep. 11, 2018
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventor:
Motoki Ito, Ikoma, JP;
Assignee:
KYOCERA Corporation, Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 9/25 (2006.01); H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
H03H 9/059 (2013.01); H01L 41/047 (2013.01); H03H 9/25 (2013.01);
Abstract
A SAW device includes a mounting substrate including a mounting surface, a SAW chip mounted on the mounting surface, a dummy chip mounted on the mounting surface, and a resin part covering the acoustic wave chip and the dummy chip. The dummy chip includes an insulating dummy substrate, and one or more dummy terminals which are located on a surface of the dummy substrate on the mounting surface side and are bonded to the mounting surface. The dummy chip configures an open end when electrically viewed from the mounting substrate side.