Millimeter wave module including first and second conductor patterns connected by first and second conductive members extending through an insulating substrate and methods of manufacture

Abstract

Signal conductor patterns () are respectively formed on a first main surface () and a second main surface () of an insulating substrate (). Ground conductor patterns () are formed on the first main surface () and the second main surface (). A first conductive member () is formed in the insulating substrate () and electrically connects the signal conductor patterns () in the thickness direction. A second conductive member () is formed in the insulating substrate () and connected to the ground conductor patterns (). A dielectric member () is disposed between the first conductive member () and the second conductive member (), is in contact with the first conductive member () and the second conductive member (), and has a dielectric constant different from the dielectric constant of the insulating substrate ().