The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Jan. 21, 2020
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Daniel Brodoceanu, Cork, IE;

Oscar Torrents Abad, Cork, IE;

Jeb Wu, Redmond, WA (US);

Zheng Sung Chio, Cork, IE;

Sharon Nanette Farrens, Cork, IE;

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/52 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); G02B 27/01 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); G02B 27/0172 (2013.01); G02B 2027/0178 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/8312 (2013.01); H01L 2224/83031 (2013.01); H01L 2224/83092 (2013.01); H01L 2224/83099 (2013.01); H01L 2224/83224 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83859 (2013.01); H01L 2224/83895 (2013.01); H01L 2224/83896 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.


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