The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Oct. 01, 2020
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Byeong Beom Kim, Asan-si, KR;

Min Ki Kim, Hwaseong-si, KR;

Yu Ri Kim, Guri-si, KR;

Woo Suk Seo, Yongin-si, KR;

Hoi Kwan Lee, Suwon-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 27/32 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3276 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/09 (2013.01); H01L 24/80 (2013.01); H01L 25/18 (2013.01); H01L 2224/0383 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/0568 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05671 (2013.01); H01L 2224/0807 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/0915 (2013.01); H01L 2224/80205 (2013.01);
Abstract

A display device includes a display panel including panel pads adjacent to the side surface of a display panel; connection pads disposed on the side surface of the display panel and connected to the panel pads; and a circuit board disposed on the side surface of the display panel and including lead signal lines directly bonded to the connection pads, wherein the connection pads include a first connection pad, a second connection pad disposed on the first connection pad, and a third connection pad disposed on the second connection pad, and the first connection pad is in contact with corresponding one of the panel pads, and the third connection pad is directly bonded to corresponding one of the lead signal lines.


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