The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Jan. 21, 2021
Applicant:

SK Hynix Inc., Icheon-si, KR;

Inventors:

Se Jin Park, Icheon-si, KR;

Jang Hee Lee, Icheon-si, KR;

Assignee:

SK hynix Inc., Icheon-si Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06582 (2013.01);
Abstract

A stack package includes a package substrate; a lower stack including lower dies stacked on the package substrate to form a zigzag shape in a vertical direction; an upper stack including upper dies that are sequentially offset stacked in an offset direction while providing a first upper side of a down staircase shape, a first end of an uppermost upper die among the upper dies protruding, in a horizontal direction, further than a first lower side of the lower stack; and a first passive device disposed on the package substrate and spaced apart from the first lower side, and disposed between a first portion of the package substrate and the first upper side.


Find Patent Forward Citations

Park, Se. (2023). Stack packages including passive devices (U.S. Patent No. 11557571). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11557571

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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