The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Oct. 18, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Keiji Harada, Tokyo, JP;
Shuhei Mizutani, Tokyo, JP;
Yoshihiro Taniguchi, Tokyo, JP;
Masaki Takata, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 1/12 (2006.01); H01L 23/13 (2006.01); H05K 1/02 (2006.01); H02M 1/42 (2007.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H05K 1/0201 (2013.01); H05K 1/0272 (2013.01); H05K 7/20163 (2013.01); H05K 7/20336 (2013.01); F28F 1/12 (2013.01); H02M 1/4225 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10416 (2013.01);
Abstract
Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.