The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Oct. 29, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Yann A. M. Mignot, Slingerlands, NY (US);
Chih-Chao Yang, Glenmont, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76814 (2013.01); H01L 21/02063 (2013.01); H01L 21/76811 (2013.01); H01L 21/76816 (2013.01); H01L 21/76831 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01);
Abstract
A semiconductor structure includes a multilayer structure having a first layer and a second layer disposed on the first layer. The semiconductor structure further includes at least a first via extending from a top of the second layer to a top of a first metal contact disposed in the first layer. A polymer film is disposed on at least a portion of sidewalls of the first via.