The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Jan. 03, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Hitoshi Ohkubo, Tokyo, JP;

Masazumi Arata, Tokyo, JP;

Manabu Ohta, Tokyo, JP;

Yuuya Kaname, Tokyo, JP;

Yoshihiro Maeda, Tokyo, JP;

Takahiro Kawahara, Tokyo, JP;

Hokuto Eda, Tokyo, JP;

Shigeki Sato, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/325 (2013.01); H01F 17/0006 (2013.01); H01F 17/0013 (2013.01); H01F 2017/048 (2013.01);
Abstract

A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.


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