The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Dec. 17, 2020
Applicants:

Sony Group Corporation, Tokyo, JP;

Sony Corporation of America, New York, NY (US);

Inventors:

Jie Hu, San Jose, CA (US);

Mohammad Gharavi-Alkhansari, San Jose, CA (US);

Assignees:

SONY GROUP CORPORATION, Tokyo, JP;

SONY CORPORATION OF AMERICA, New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 17/00 (2006.01); G06T 3/00 (2006.01);
U.S. Cl.
CPC ...
G06T 17/00 (2013.01); G06T 3/0037 (2013.01); G06T 3/0093 (2013.01);
Abstract

An electronic device and method for 3D modeling based on 2D warping is disclosed. The electronic device acquires a color image of a face of a user, depth information corresponding to the color image, and a point cloud of the face. A 3D mean-shape model of a reference 3D face is acquired, and rigid aligned with the point cloud. A 2D projection of the aligned 3D mean-shape model is generated. The 2D projection includes a set of landmark points associated with the aligned 3D mean-shape model. The 2D projection is warped such that the set of landmark points in the 2D projection is aligned with a corresponding set of feature points in the color image. A 3D correspondence between the aligned 3D mean-shape model and the point cloud is determined for a non-rigid alignment of the aligned 3D mean-shape model, based on the warped 2D projection and the depth information.


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