The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Aug. 01, 2022
Qingdao University of Technology, Qingdao, CN;
China Construction Fifth Engineering Division Corp, Baoding, CN;
Guilin University of Technology, Guilin, CN;
Guangming Yu, Qingdao, CN;
Penghui Zhang, Qingdao, CN;
Jun Lei, Qingdao, CN;
Bin Peng, Qingdao, CN;
Lijun Kuang, Qingdao, CN;
Weiting Luo, Qingdao, CN;
Zihan Yang, Qingdao, CN;
Xinpeng Yao, Qingdao, CN;
Zhiwen Tan, Qingdao, CN;
Qiang Yue, Qingdao, CN;
Jiaming Du, Qingdao, CN;
Ze Chen, Qingdao, CN;
Hao Liu, Qingdao, CN;
Li Zhang, Qingdao, CN;
Shuguang Zhang, Qingdao, CN;
Qingdao University of Technology, Qingdao, CN;
China Construction Fifth Engineering Division Corp., Ltd., Baoding, CN;
Guilin University of Technology, Guilin, CN;
Abstract
A test method based on a test system for five-dimensional space effects of ground surface settlement caused by dual-mode shield construction is provided. First, manufacturing a formation similarity material model; then, laying ground surface monitoring points in longitudinal and transverse direction; installing a shield machine model, and performing shield construction, the shield machine model adopts a double-shield body mode; performing five-dimensional monitoring during shield construction; designing an observation method for ground surface settlement data in step length and time dimension, and acquiring five-dimensional data in combination with three-dimensional scanning; and finally, performing deformation information processing according to the monitored data, so as to realize an acquisition of the five-dimensional data.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile