The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Nov. 10, 2020
Hitachi Metals, Ltd., Tokyo, JP;
Keisuke Sugita, Tokyo, JP;
Masahiro Abe, Tokyo, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
A method for manufacturing a pressure-sensitive sensor includes providing an extruder that includes a cylindrical die, a mandrel arranged inside the die and having plural helical grooves on an outer circumferential surface, and an annular outlet sandwiched between the die and the mandrel, and by using the extruder, performing simultaneous extrusion-molding of an elastic insulating material and an elastic conductive material by supplying the elastic conductive material into not less than two of the grooves from the inside of the mandrel while extruding the elastic insulating material, so as to form a pressure-sensitive sensor. The sensor includes a tubular body including an elastic insulation and having a hollow portion along a longitudinal direction, and not less than two conductive ribs including an elastic conductor and helically provided along an inner circumferential surface of the hollow portion of the tubular body so as to protrude inward from the inner circumferential surface.