The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

May. 22, 2018
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventor:

Ryosuke Yamazaki, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); B29C 45/00 (2006.01); H01L 23/29 (2006.01); B29C 43/00 (2006.01); C08K 3/013 (2018.01); C08K 9/06 (2006.01); B29K 83/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); B29C 43/003 (2013.01); B29C 45/0001 (2013.01); C08K 3/013 (2018.01); C08K 9/06 (2013.01); H01L 23/296 (2013.01); B29K 2083/00 (2013.01); B29K 2105/251 (2013.01); C08K 2201/003 (2013.01);
Abstract

A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/° C. in a range of from 25° C. to 200° C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.


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