The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Oct. 21, 2019
Applicant:

Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v., Munich, DE;

Inventors:

Harald Schenk, Dresden, DE;

Holger Conrad, Dresden, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/24 (2006.01); B81B 3/00 (2006.01); H04R 5/033 (2006.01); H04R 7/06 (2006.01); H04R 19/00 (2006.01); H04R 19/02 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 3/0027 (2013.01); H04R 1/24 (2013.01); H04R 5/033 (2013.01); H04R 7/06 (2013.01); H04R 19/005 (2013.01); H04R 19/02 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/032 (2013.01); B81B 2201/036 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); H04R 2201/003 (2013.01); H04R 2420/07 (2013.01);
Abstract

A MEMS transducer for interacting with a volume flow of a fluid includes a substrate which includes a layer stack having a plurality of layers which form a plurality of substrate planes, and which includes a cavity within the layer stack. The MEMS transducer includes an electromechanical transducer connected to the substrate within the cavity and including an element which is deformable within at least one plane of movement of the plurality of substrate planes, deformation of the deformable element within the plane of movement and the volume flow of the fluid being causally correlated. The MEMS transducer includes an electronic circuit arranged within a layer of the layer stack, the electronic circuit being connected to the electromechanical transducer and being configured to provide a conversion between a deformation of the deformable element and an electric signal.


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