The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Nov. 13, 2020
Applicants:

Rolls-royce Corporation, Indianapolis, IN (US);

Rolls-royce North American Technologies, Inc., Indianapolis, IN (US);

Inventors:

Quinlan Yee Shuck, Indianapolis, IN (US);

Scott Nelson, Carmel, IN (US);

Raymond Ruiwen Xu, Carmel, IN (US);

Brandon David Ribic, Noblesville, IN (US);

Matthew R. Gold, Carmel, IN (US);

Assignees:

Rolls-Royce Corporation, Indianapolis, IN (US);

Rolls-Royce North American Technologies, Inc., Indianapolis, IN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B33Y 70/00 (2020.01); B29C 64/245 (2017.01); B29C 64/295 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); B29L 31/08 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 64/245 (2017.08); B29C 64/295 (2017.08); B29C 64/393 (2017.08); B33Y 70/00 (2014.12); B29L 2031/08 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12);
Abstract

A method may include fused filament fabricating a fused filament fabricated component by delivering a softened filament to selected locations at or adjacent to a build surface. The softened filament may include a sacrificial binder and a powder including a shape memory alloy (SMA). The method also may include removing substantially all the sacrificial binder from the fused filament fabricated component to leave an unsintered component; and sintering the unsintered component to join particles of the SMA and form an SMA component.


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