The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Feb. 13, 2019
Sumco Corporation, Tokyo, JP;
Yuki Nakano, Tokyo, JP;
Katsuhisa Sugimori, Tokyo, JP;
Kazuaki Kozasa, Tokyo, JP;
Jiro Kajiwara, Tokyo, JP;
Katsutoshi Yamamoto, Tokyo, JP;
Takayuki Kihara, Tokyo, JP;
Ryoya Terakawa, Tokyo, JP;
SUMCO CORPORATION, Tokyo, JP;
Abstract
A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.