The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

May. 15, 2019
Applicant:

Fanuc Corporation, Yamanashi, JP;

Inventor:

Takashi Izumi, Yamanashi, JP;

Assignee:

FANUC CORPORATION, Yamanashi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/10 (2006.01); B23K 26/00 (2014.01); B23K 26/03 (2006.01); B23K 26/082 (2014.01); G05B 13/02 (2006.01); B23K 26/38 (2014.01); B23K 26/70 (2014.01); B23K 31/00 (2006.01); B23K 26/14 (2014.01);
U.S. Cl.
CPC ...
B23K 31/10 (2013.01); B23K 26/0006 (2013.01); B23K 26/034 (2013.01); B23K 26/082 (2015.10); B23K 26/1464 (2013.01); B23K 26/38 (2013.01); B23K 26/707 (2015.10); B23K 31/006 (2013.01); G05B 13/021 (2013.01); G05B 13/027 (2013.01);
Abstract

Disclosed is a machine learning device of a cutting condition adjustment apparatus including: a state observation section that observes, as state variables indicating a current state of an environment, cutting condition data indicating a laser cutting condition for a laser cutting and oblique rearward temperature rise data indicating a temperature rise value at an oblique rearward part of a cutting front of a workpiece, a determination data acquisition unit that acquires temperature rise value determination data for determining propriety of the temperature rise value during cutting based on the laser cutting condition for the laser cutting as determination data indicating a propriety determination result of the cutting of the workpiece, and a learning unit that learns the temperature rise value and adjustment of the laser cutting condition for the laser cutting in association with each other using the state variables and the determination data.


Find Patent Forward Citations

Izumi, Takashi. (2023). Machining condition adjustment apparatus and machine learning device (U.S. Patent No. 11554448). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11554448

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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