The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Aug. 30, 2018
Applicant:
Yushiro Chemical Industry Co., Ltd., Tokyo, JP;
Inventors:
Yasunori Numata, Kanagawa, JP;
Koji Soga, Kanagawa, JP;
Shinsuke Morimoto, Kanagawa, JP;
Yasuhiro Hattori, Kanagawa, JP;
Assignee:
Yushiro Chemical Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22C 3/00 (2006.01); B22C 23/02 (2006.01); B22D 17/20 (2006.01); C10M 107/50 (2006.01); C10M 145/22 (2006.01); C08G 63/12 (2006.01); C08F 8/14 (2006.01);
U.S. Cl.
CPC ...
B22C 3/00 (2013.01); B22C 23/02 (2013.01); B22D 17/2007 (2013.01); C08F 8/14 (2013.01); C08G 63/12 (2013.01); C10M 107/50 (2013.01); C10M 145/22 (2013.01);
Abstract
Provided is a mold release agent composition containing a polymer ester, the composition exerting a good mold releasability even when the temperature of mold increases, and a die casting method using the composition.