The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Nov. 27, 2020
National Taipei University of Technology, Taipei, TW;
Ceramenergy Technology Co., Ltd., Taoyuan, TW;
NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY, Taipei, TW;
CERAMENERGY TECHNOLOGY CO., LTD., Taoyuan, TW;
Abstract
A method for preparing a modular planar interconnect plate includes steps of a) providing a metal blank sheet having a main region and two first lateral regions, b) forming two openings respectively in the first lateral regions, and c) stamping to form protrusions and depressions at the main region on lower and upper surfaces of the metal blank sheet. In the stamping step, each of two lower surrounding protrusions and two upper surrounding depressions is formed to surround a corresponding one of the openings, and each of an upper surrounding protrusion and a lower surrounding depression is formed to surround the first lateral regions and the corresponding ones of the protrusions and depressions formed at the main region.