The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Dec. 13, 2019
Applicant:
At&s (Chongqing) Company Limited, Chongqing, CN;
Inventor:
Yu-Hui Wu, Taoyuan, TW;
Assignee:
AT&S(Chongqing) Company Limited, Chongqing, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/58 (2006.01); H01L 21/60 (2006.01); H01L 21/78 (2006.01); H01L 21/98 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/06 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/50 (2006.01); H01L 23/52 (2006.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 1/111 (2013.01); H05K 1/144 (2013.01); H05K 3/24 (2013.01); H05K 3/465 (2013.01); H05K 3/4682 (2013.01);
Abstract
A component carrier includes a stack with an electrically conductive layer structure and an electrically insulating layer structure. The electrically conductive layer structure having a first plating structure and a pillar. The pillar has a seed layer portion on the first plating structure and a second plating structure on the seed layer portion. A method of manufacturing such a component carrier and an arrangement including such a component carrier are also disclosed.