The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Dec. 28, 2021
Applicant:

Realtek Semiconductor Corp., Hsinchu, TW;

Inventors:

Chin-Yuan Lo, Hsinchu, TW;

Nan-Chin Chuang, Hsinchu, TW;

Hsin-Hui Lo, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H05K 1/0224 (2013.01); H05K 2201/10689 (2013.01);
Abstract

A circuit board and an electronic apparatus using the same are provided. The circuit board includes an integrated-circuit (IC) device arrangement region and an electronic device arrangement region. The circuit board includes a first external wiring layer and an inner wiring layer. The first external wiring layer includes a plurality of first signal traces and a ground extending portion that extend from the IC device arrangement region to the electronic device arrangement region. The inner wiring layer includes a ground portion and an inner signal trace. The ground portion defines an opening region, and the inner signal trace is located in the opening region and extends from a position under the IC device arrangement region to another position under the electronic device region. The ground extending portion and the opening region overlap with each other in a thickness direction of the circuit board.


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