The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Jul. 19, 2018
Applicant:

National Technology & Engineering Solutions of Sandia, Llc, Albuquerque, NM (US);

Inventors:

Jeffrey S. Nelson, Albuquerque, NM (US);

Michael Hibbs, Albuquerque, NM (US);

Gregory N. Nielson, Lehi, UT (US);

Murat Okandan, Edgewood, NM (US);

Jose Luis Cruz-Campa, Albuquerque, NM (US);

Paul J. Resnick, Albuquerque, NM (US);

Carlos Anthony Sanchez, Belen, NM (US);

Vipin P. Gupta, Glenview, IL (US);

Peggy J. Clews, Tijeras, NM (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/05 (2014.01); H01L 31/0465 (2014.01); H01L 31/048 (2014.01); H01L 31/0224 (2006.01); H02S 30/20 (2014.01); H02S 10/40 (2014.01); H01L 31/054 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0516 (2013.01); H01L 31/022441 (2013.01); H01L 31/048 (2013.01); H01L 31/0465 (2014.12); H01L 31/0512 (2013.01); H01L 31/0547 (2014.12); H02S 10/40 (2014.12); H02S 30/20 (2014.12); Y02E 10/50 (2013.01); Y02E 10/547 (2013.01);
Abstract

A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.


Find Patent Forward Citations

Loading…