The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Feb. 18, 2020
Applicant:
Tcl China Star Optoelectronics Technologyco., Ltd., Shenzhen, CN;
Inventor:
Meng Chen, Shenzhen, CN;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 27/127 (2013.01); H01L 27/1222 (2013.01); H01L 27/1244 (2013.01); H01L 27/1259 (2013.01);
Abstract
An array substrate and a manufacturing method thereof are provided. A patterned metal member of the array substrate includes a patterned first metal layer, a patterned second metal layer, and a patterned copper layer which are sequentially disposed on a substrate. An etching rate at which an etching solution etches the second metal layer is less than another etching rate at which the etching solution etches the first metal layer. An adhesion force between the patterned first metal layer and the substrate is greater than another adhesion force between the patterned copper layer and the substrate.