The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Mar. 04, 2020
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Andreas Bibi, Los Altos, CA (US);

John A. Higginson, Santa Clara, CA (US);

Hung-Fai Stephen Law, Los Altos, CA (US);

Hsin-Hua Hu, Los Altos, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/67 (2006.01); B32B 38/18 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 29/167 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B32B 38/18 (2013.01); H01L 21/67144 (2013.01); H01L 24/75 (2013.01); H01L 24/95 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 29/167 (2013.01); H01L 33/62 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75725 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/97 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01); H01L 2933/0066 (2013.01); Y10T 156/1153 (2015.01); Y10T 156/17 (2015.01); Y10T 156/1705 (2015.01); Y10T 156/1707 (2015.01); Y10T 156/1744 (2015.01); Y10T 156/1749 (2015.01); Y10T 156/1776 (2015.01); Y10T 156/1911 (2015.01);
Abstract

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.


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