The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Aug. 11, 2020
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Federico Giovanni Ziglioli, Pozzo d'Adda, IT;
Alberto Pintus, Gessate, IT;
Michele Derai, Millano, IT;
Pierangelo Magni, Villasanta, IT;
STMicroelectronics S.r.l., Agrate Brianza, IT;
Abstract
A method of manufacturing semiconductor devices, such as integrated circuits includes arranging one or more semiconductor dice on a support surface. Laser direct structuring material is molded onto the support surface having the semiconductor die/dice arranged thereon. Laser beam processing is performed on the laser direct structuring material molded onto the support surface having the semiconductor die/dice arranged thereon to provide electrically conductive formations for the semiconductor die/dice arranged on the support surface. The semiconductor die/dice provided with the electrically-conductive formations are separated from the support surface.