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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11552021 B1

PDFFull Text
Date of Patent:
Jan. 10, 2023

Filed:

Nov. 10, 2020

Semiconductor device, semiconductor manufacturing apparatus and method of manufacturing semiconductor device having printed circuit board and insulating board with complementary warps

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Yuhei Nishida, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:

Quoc D Hoang

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/67 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5385 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/67132 (2013.01); H01L 21/67288 (2013.01); H01L 23/4985 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01);
Abstract

A semiconductor device includes: a first insulating circuit substrate; a first semiconductor chip mounted on a top surface of the first insulating circuit substrate; a printed circuit board arranged over the first insulating circuit substrate; a first external terminal inserted to the printed circuit board and having one end bonded to the top surface of the first insulating circuit substrate; and a first pin inserted to the printed circuit board and having one end bonded to a top surface of the first semiconductor chip, wherein the first insulating circuit substrate and the printed circuit board having warps complimentary to each other.

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