The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Feb. 18, 2021
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Shin Suzuki, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/043 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/043 (2013.01); H01L 23/49811 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H05K 1/18 (2013.01); H01L 2224/48091 (2013.01);
Abstract
A semiconductor device includes: a case having an opening; a semiconductor element contained in the case; a control substrate which is disposed above the semiconductor element in the case and on which a control circuit to control the semiconductor element is disposed; a lid to cover the opening of the case; and a control terminal having one end portion connected to the control circuit disposed on the control substrate and the other end portion protruding out of the case. The control terminal has a bend in the case, and a side portion of the case or the lid is provided with a support capable of supporting the bend.