The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Mar. 01, 2021
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Takanobu Ono, Kuwana Mie, JP;
Keisuke Tokubuchi, Yokkaichi Mie, JP;
Akira Tomono, Yokkaichi Mie, JP;
Assignee:
KIOXIA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 23/5383 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/94 (2013.01); H01L 25/18 (2013.01); H01L 2224/11552 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/1369 (2013.01); H01L 2224/13551 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1438 (2013.01);
Abstract
A method for manufacturing a semiconductor device includes providing an adhesive film over a first surface of a semiconductor wafer on which a semiconductor device layer and a bump electrically connected to the semiconductor device layer are formed, forming a slit in the adhesive film, fragmenting the semiconductor wafer into semiconductor chips along the slit, and connecting the bump to a wiring of a circuit board within the adhesive film.