The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Aug. 03, 2018
Applicant:

Toyota Motor Europe, Brussels, BE;

Inventors:

Sachin Kinge, Brussels, BE;

Hannah Johnson, Brussels, BE;

Kevin Sivula, Lausanne, CH;

Rebekah Anne Wells, Lausanne, CH;

Assignee:

TOYOTA MOTOR EUROPE, Brussels, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/20 (2006.01); H01L 21/02 (2006.01); B22F 7/04 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H01L 21/02568 (2013.01); B05D 1/202 (2013.01); H01L 21/02601 (2013.01); H01L 21/02628 (2013.01); B22F 2007/042 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

A method for preparing a semiconducting thin film and device for carrying out the method, wherein the method includes: (1) providing a liquid-liquid interface; (2) providing at least one layered semiconductor material or its precursor(s) in the form of particles in a solvent in the form of a dispersion; (3) injecting the dispersion at the liquid-liquid interface, in order to obtain an assembly of semiconductor/semiconductor precursor particles; (4) bringing the assembly of into contact with a flexible substrate; and (5) applying a surface pressure to the dispersion to obtain a particle film of semiconductor/semiconductor precursor on the substrate, wherein the first solvent has a higher density than the second solvent.


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