The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Mar. 21, 2021
Applicant:

Thinkon New Technology Japan Corporation, Tokyo, JP;

Inventors:

Atsushi Ikari, Shunan, JP;

Satoshi Fujii, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C30B 29/06 (2006.01); H01L 21/67 (2006.01); H01L 21/3065 (2006.01); C30B 33/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32642 (2013.01); C30B 29/06 (2013.01); C30B 33/06 (2013.01); H01J 37/32807 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01L 24/03 (2013.01); H01J 2237/3341 (2013.01);
Abstract

Provided are a method of manufacturing a ring-shaped member and the ring-shaped member. A method of manufacturing a ring-shaped member to be placed in a process chamber of a substrate processing apparatus includes arranging one silicon member and another silicon member to cause one abutting surface of the one silicon member and another abutting surface of the other silicon member to abut on each other, heating the one abutting surface and the other abutting surface through optical heating to melt silicon on a surface of the one abutting surface and silicon on a surface of the other abutting surface such that silicon melt is caused to flow into a gap between the one abutting surface and the other abutting surface, and cooling the one abutting surface and the other abutting surface to crystallize the silicon melt forming a silicon adhesion part.


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