The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Jun. 25, 2021
Applicant:

Eagle Harbor Technologies, Inc., Seattle, WA (US);

Inventors:

Timothy Ziemba, Bainbridge Island, WA (US);

Ilia Slobodov, Seattle, WA (US);

John Carscadden, Seattle, WA (US);

Kenneth Miller, Seattle, WA (US);

James Prager, Seattle, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H02M 3/335 (2006.01); H03K 3/57 (2006.01); H05K 7/20 (2006.01); H03M 1/12 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32146 (2013.01); H01J 37/32082 (2013.01); H01J 37/32091 (2013.01); H01J 37/32128 (2013.01); H01J 37/32174 (2013.01); H01J 37/32541 (2013.01); H01J 37/32568 (2013.01); H01J 37/32715 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); H02M 3/33523 (2013.01); H03K 3/57 (2013.01); H03M 1/12 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); H05K 7/20509 (2013.01);
Abstract

A plasma deposition system comprising a wafer platform, a second electrode, a first electrode, a first high voltage pulser, and a second high voltage pulser. In some embodiments, the second electrode may be disposed proximate with the wafer platform. In some embodiments, the second electrode can include a disc shape with a central aperture; a central axis, an aperture diameter, and an outer diameter. In some embodiments, the first electrode may be disposed proximate with the wafer platform and within the central aperture of the second electrode. In some embodiments, the first electrode can include a disc shape, a central axis, and an outer diameter. In some embodiments, the first high voltage pulser can be electrically coupled with the first electrode. In some embodiments, the second high voltage pulser can be electrically coupled with the second electrode.


Find Patent Forward Citations

Ziemba, Timothy. (2023). Spatially variable wafer bias power system (U.S. Patent No. 11551908). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11551908

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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