The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

H01F 27/02 (2006.01); H01F 27/255 (2006.01); H01F 19/00 (2006.01); H01F 41/04 (2006.01); H01F 27/28 (2006.01); H01F 17/04 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01); H01F 5/00 (2006.01);

U.S. Cl.

CPC ...

H01F 27/255 (2013.01); H01F 5/00 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 19/00 (2013.01); H01F 27/02 (2013.01); H01F 27/022 (2013.01); H01F 27/2871 (2013.01); H01F 27/292 (2013.01); H01F 27/323 (2013.01); H01F 41/04 (2013.01); H01F 41/041 (2013.01); H01F 2017/048 (2013.01);

Abstract

A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

Find Patent Forward Citations

Jang, Jin. (2023). Coil component and method for fabricating the same (U.S. Patent No. 11551850). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11551850

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile