The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Jan. 19, 2018
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventor:
Makoto Yamamoto, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 27/30 (2006.01); H01F 41/16 (2006.01); H01F 1/36 (2006.01); H01F 3/14 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 1/36 (2013.01); H01F 3/14 (2013.01); H01F 27/30 (2013.01); H01F 41/04 (2013.01); H01F 41/046 (2013.01); H01F 41/16 (2013.01); H01F 27/292 (2013.01); H01F 41/043 (2013.01);
Abstract
A layered electronic component includes a multilayer body having a metallic magnetic material layer including metallic magnetic material particles and a coil being built in the multilayer body. The coil is formed of multiple conductor patterns spirally connected each other and stacked along an axis direction of the coil, and the multilayer body includes a nonmagnetic ferrite part arranged at least an inner area of the coil when viewed from a winding axis direction of the coil.