The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Aug. 05, 2021
Applicant:

Ii-vi Delaware, Inc, Wilmington, DE (US);

Inventors:

Li Zhang, Shanghai, CN;

Bangjia Wu, Chengdu, CN;

Huiping Li, Shanghai, CN;

Assignee:

II-VI DELAWARE, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/01 (2006.01); H01L 23/34 (2006.01); H01L 21/02 (2006.01); H01L 31/0304 (2006.01); H01L 29/66 (2006.01); H01L 29/20 (2006.01); B32B 7/023 (2019.01); B32B 17/10 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G02F 1/0147 (2013.01); B32B 7/023 (2019.01); B32B 17/10477 (2013.01); G02F 1/0121 (2013.01); H01L 21/02005 (2013.01); H01L 21/02024 (2013.01); H01L 21/02104 (2013.01); H01L 22/10 (2013.01); H01L 23/34 (2013.01); H01L 23/345 (2013.01); H01L 29/20 (2013.01); H01L 29/66007 (2013.01); H01L 31/0304 (2013.01); G02F 2203/055 (2013.01);
Abstract

A method may include thinning a silicon wafer to a particular thickness. The particular thickness may be based on a passband frequency spectrum of an adjustable optical filter. The method may also include covering a surface of the silicon wafer with an optical coating. The optical coating may filter an optical signal and may be based on the passband frequency spectrum. The method may additionally include depositing a plurality of thermal tuning components on the coated silicon wafer. The plurality of thermal tuning components may adjust a passband frequency range of the adjustable optical filter by adjusting a temperature of the coated silicon wafer. The passband frequency range may be within the passband frequency spectrum. The method may include dividing the coated silicon wafer into a plurality of silicon wafer dies. Each silicon wafer die may include multiple thermal tuning components and may be the adjustable optical filter.


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